- bonder capillary
- 焊接颇毛细管
English-Chinese electron industry dictionary (英汉电子工程大词典). 2013.
bonder capillary
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Ball bonding — is a type of wire bonding, and is the most common way to make the electrical interconnections between a microchip and the outside world as part of semiconductor device fabrication.Gold or copper wire can be used, though gold is more common… … Wikipedia
